Paper Title:
A New Method of Mapping and Counting Micropipes in SiC Wafers
  Abstract

Micropipes are considered to be a major device killer in SiC wafers. Developing a method to count and map micropipes efficiently and accurately has been a challenging task to date. In this work, a new method based on KOH etching and full wafer, high resolution digital imaging is developed to map and count micropipes in both conductive and semi-insulating SiC wafers. This method is also compared with a non-destructive method based on laser light scattering and a good agreement between the two methods is demonstrated.

  Info
Periodical
Materials Science Forum (Volumes 527-529)
Edited by
Robert P. Devaty, David J. Larkin and Stephen E. Saddow
Pages
447-450
DOI
10.4028/www.scientific.net/MSF.527-529.447
Citation
J. W. Wan, S. H. Park, G. Y. Chung, E.P. Carlson, M. J. Loboda, "A New Method of Mapping and Counting Micropipes in SiC Wafers", Materials Science Forum, Vols. 527-529, pp. 447-450, 2006
Online since
October 2006
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Price
$32.00
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