Paper Title:
Simple, Calibrated Analysis and Mapping of SiC Wafer Defects by Birefringence Imaging
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Periodical
Materials Science Forum (Volumes 527-529)
Edited by
Robert P. Devaty, David J. Larkin and Stephen E. Saddow
Pages
721-724
DOI
10.4028/www.scientific.net/MSF.527-529.721
Citation
S. H. Park, M. J. Loboda, M. J. Spaulding, "Simple, Calibrated Analysis and Mapping of SiC Wafer Defects by Birefringence Imaging", Materials Science Forum, Vols. 527-529, pp. 721-724, 2006
Online since
October 2006
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