Paper Title:
Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process
  Abstract

In this paper, the wear behavior of the ID (inner diameter) saw blade in the cutting process of silicon ingot was observed with SEM. Its wear mechanism was discussed and the relation between the blade wear and vibration, deflection was analyzed. The results show that the blade worn manners include flatted diamond, micro-fractured diamond, macro-fractured diamond, pulled-out hole, tortoise-fractured bond, and polished bond. In the abnormal working stage of a blade, however, the working surface of the blade is displayed mainly with pulled out diamond, flatted diamond, macro-fractured diamond grains. Abnormal initial tension condition will induce severe vibration and deflection, and so then lots of diamond grits fractured or pulled out too early.

  Info
Periodical
Materials Science Forum (Volumes 532-533)
Edited by
Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu
Pages
157-160
DOI
10.4028/www.scientific.net/MSF.532-533.157
Citation
X. Wei, H. Yuan, R. W. Huang, S. H. Lai, "Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process", Materials Science Forum, Vols. 532-533, pp. 157-160, 2006
Online since
December 2006
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Price
$32.00
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