Paper Title:
Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing
  Abstract

The within-wafer non-uniformity (WIWNU) of material removal rate in chemical mechanical polishing (CMP) is important for IC manufacture. The non-uniform distributions of polishing pressure and the relative speed between the wafer and the polishing pad are main factors affecting the WIWNU. In this paper,based on the contact mechanics and the elastic plate theory, a compensate pressure computing model is presented, in which the effects of kinematic parameters are taken into acount. By modelling and calculating, the desired compensate back pressure distribution is obtained. In the last section the design of a schematic carrier with multi-zone, in which the compensate back pressure can be applied, is presented. The model and the design can be used for providing theoretical guide to the development of CMP equipments and selection of the kinematic variables in CMP process.

  Info
Periodical
Materials Science Forum (Volumes 532-533)
Edited by
Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu
Pages
233-236
DOI
10.4028/www.scientific.net/MSF.532-533.233
Citation
Y. H. Sun, R. K. Kang, D. M. Guo, "Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing", Materials Science Forum, Vols. 532-533, pp. 233-236, 2006
Online since
December 2006
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$32.00
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