Study on the Thermal Properties of Phenolic Resin Mix-Modified by Nano-Alumina |
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| Journal | Materials Science Forum (Volumes 532 - 533) |
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| Volume | Advances in Materials Manufacturing Science and Technology II |
| Edited by | Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu |
| Pages | 329-332 |
| DOI | 10.4028/www.scientific.net/MSF.532-533.329 |
| Citation | Lin He et al., 2006, Materials Science Forum, 532-533, 329 |
| Online since | December, 2006 |
| Authors | Lin He, Li Hua Yu, Jian Wei Yan, Chun Yan chen, Xiu Fang Bian |
| Keywords | Mix-Modification, Nano-Alumina, Phenolic Resin, Thermal Stability |
| Abstract | In the present research the thermal properties of phenolic resin 2123-P mix-modified by nano-alumina are investigated. The nano-alumina employed in the research can be classified two kinds, one is treated by 1%wt. silane coupling agent KH-550 relative to the weight of alumina, and the other is commercial alumina untreated. DTA-TG results show the thermal stability and anti-weight loss ability of the mix-modified phenolic resin 2123-P with KH-550 treated alumina are increased relative to those of the pure 2123-P and those of the mix-modified 2123-P with commercial alumina, and the results are to be proved by the constant speed friction and wear tests. It can be observed from SEM that KH-550 treated nano-alumina particles are dispersed equably in phenolic resin. |
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