Paper Title:
Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics
  Abstract

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

  Info
Periodical
Materials Science Forum (Volumes 532-533)
Edited by
Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu
Pages
357-360
DOI
10.4028/www.scientific.net/MSF.532-533.357
Citation
Y. C. Liang, D. G. Li, Q. S. Bai, Y. L. Tang, "Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics", Materials Science Forum, Vols. 532-533, pp. 357-360, 2006
Online since
December 2006
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Price
$32.00
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