In this paper, an experimental study was carried out to fabricate a new kind of ultra-fine abrasive polishing pad by means of gel technology. The polishing pad was then used to polish silicon wafer on a nano-polishing machine. Optical microscope and ZYGO 3D surface analyzer were applied to observe the surface morphologies of the silicon wafer. Meanwhile, surface morphology of ultra-fine abrasive polishing pad was observed by ESEM. No obvious gathering of ultra-fine grains were found on the ultra-fine abrasive pad. The surface roughness (Ra) of the silicon wafer was reduced to 0.3nm after being polished by the abrasives with average grain size of 10μm. Mirror surface can be realized after being polished with the polishing pad.