Paper Title:
Properties of TiAl and TiAlN Thin Films by Pulsed Cathodic ARC
  Abstract

TiAl and TiAlN thin films are deposited on glassy carbon and Si substrates by the pulsed cathodic arc deposition process. In our pulsed cathodic arc system, because the spatial position of plasma on the surface of the evaporation source can be controlled by pulsed arc discharge, the thickness of the TiAl and TiAlN films can be controlled at nanometer scale. Amorphous stoichiometric Ti-Al films are synthesized from one Ti-Al alloy target at room temperature by changing the number of pulses of the arc discharge.

  Info
Periodical
Materials Science Forum (Volumes 534-536)
Edited by
Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim
Pages
1413-1416
DOI
10.4028/www.scientific.net/MSF.534-536.1413
Citation
S.Y. Chun, C.H. Lee, S. J. Lee, "Properties of TiAl and TiAlN Thin Films by Pulsed Cathodic ARC", Materials Science Forum, Vols. 534-536, pp. 1413-1416, 2007
Online since
January 2007
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Price
$32.00
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