Paper Title:
Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route
  Abstract

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smoothes the composition gradient. Perspectives to control this migration are discussed.

  Info
Periodical
Materials Science Forum (Volumes 534-536)
Edited by
Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim
Pages
1569-1572
DOI
10.4028/www.scientific.net/MSF.534-536.1569
Citation
O. Ozer, J.M. Missiaen, C. Pascal, S. Lay, J. M. Chaix, R. Mitteau, "Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route", Materials Science Forum, Vols. 534-536, pp. 1569-1572, 2007
Online since
January 2007
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Price
$32.00
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