Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying |
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| Journal | Materials Science Forum (Volumes 534 - 536) |
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| Volume | Progress in Powder Metallurgy |
| Edited by | Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim |
| Pages | 425-428 |
| DOI | 10.4028/www.scientific.net/MSF.534-536.425 |
| Citation | Shu Xiang Song et al., 2007, Materials Science Forum, 534-536, 425 |
| Online since | January, 2007 |
| Authors | Shu Xiang Song, Zhang Jian Zhou, Juan Du, Zhi Hong Zhong, Chang Chun Ge |
| Keywords | Bonding Strength, Copper (Cu), Microstructure, Plasma Spraying, Tungsten |
| Abstract | Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers. |
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