Paper Title:
Preparation and Properties Study of Cu-MoSi2 Composites
  Abstract

The particulate dispersive strengthened Cu-MoSi2 composites were prepared by a powder metallurgy process with aim to develop novel copper based composites of reasonable strength, high thermal conductivity and low thermal expansion coefficients. Compacted samples were sintered to over 90% of theoretical density. Microstructure of the composites was investigated by SEM while mechanical properties such as tensile strength, elongation and thermal properties such as thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined as a function of the MoSi2 content and the process of fabrication. A comparative analysis of the mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the Cu-MoSi2 composites were discussed.

  Info
Periodical
Materials Science Forum (Volumes 534-536)
Edited by
Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim
Pages
581-584
DOI
10.4028/www.scientific.net/MSF.534-536.581
Citation
X. Yi, W. H. Xiong, J. Li, "Preparation and Properties Study of Cu-MoSi2 Composites", Materials Science Forum, Vols. 534-536, pp. 581-584, 2007
Online since
January 2007
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Price
$32.00
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