Paper Title:
Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder
  Abstract

The kinetics of the solid-state reactive diffusion between Au and Sn was experimentally observed using Sn/Au/Sn diffusion couples prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed at a temperature of T = 453 K. Due to annealing, AuSn, AuSn2 and AuSn4 compound layers are formed at the interface in the diffusion couple. The experimental results were used to evaluate quantitatively the effect of Ni on the growth of the Au–Sn compounds. The evaluation indicates that the addition of Ni into Sn between 1 and 5 mass% accelerates the growth of the Au–Sn compounds at T = 433–473 K.

  Info
Periodical
Materials Science Forum (Volumes 539-543)
Main Theme
Edited by
T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran
Pages
2473-2478
DOI
10.4028/www.scientific.net/MSF.539-543.2473
Citation
M. Kajihara, T. Takenaka, "Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder", Materials Science Forum, Vols. 539-543, pp. 2473-2478, 2007
Online since
March 2007
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