Paper Title:
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires
  Abstract

An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.

  Info
Periodical
Materials Science Forum (Volumes 539-543)
Main Theme
Edited by
T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran
Pages
2798-2803
DOI
10.4028/www.scientific.net/MSF.539-543.2798
Citation
L. Meng, J.B. Liu, "Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires", Materials Science Forum, Vols. 539-543, pp. 2798-2803, 2007
Online since
March 2007
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$32.00
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