Paper Title:
Alloying with Silicon and Copper in Aluminum Alloys
  Abstract

The main aim of the metallurgical investigation was to enhance our understanding of the role Cu and Si have on the development of shrinkage porosity in the as-cast structure, which in turn can affect high cycle fatigue (HCF) properties of Al-9Si-1Cu (W328) and Al- 7Si-4Cu (W319) alloys. In order to achieve this objective a novel approach using thermal analysis and calculated fraction solid techniques was developed to assess mushy zone kinetics, the state between the liquidus and solidus where a solid skeletal α-Al phase and the Al-Si eutectic phase grow at the expense of an inter-dendritic liquid. Specifically, the cooling curve and calculated fraction solid curve were partitioned into segments, which reflect different stages of feeding through the entire solidification event of the alloy. Each partitioned segment corresponds to a stage of feeding, which in turn signifies a relative degree of pore growth susceptibility. Two thermal analysis techniques, both using calibrated thermocouples, were used to precisely understand the solidification path for both the W319 alloy and the W328 alloy.

  Info
Periodical
Materials Science Forum (Volumes 539-543)
Main Theme
Edited by
T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran
Pages
392-397
DOI
10.4028/www.scientific.net/MSF.539-543.392
Citation
R. Mackay, R. Hausenbusch, J. Sokolowski, "Alloying with Silicon and Copper in Aluminum Alloys", Materials Science Forum, Vols. 539-543, pp. 392-397, 2007
Online since
March 2007
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Price
$32.00
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