Paper Title:
Cu/GDC Cermet Anodes by Sintering via Surface Modification with MgO Sol
  Abstract

CuO/GDC composite powder with 50 wt% of CuO was prepared by surface modification of ~60 nm GDC powder with Cu precursors. Since copper oxide melts at lower temperature than GDC sintering temperature, fabrication procedure was modified by inducing infiltration of molten copper oxide via capillary force and then followed by heat treatment at ~1000. Surface modification was carried out with a MgO sol to suppress agglomeration of GDC. Such prepared Cu/GDC cermets showed uniform microstructure and excellent electronic conductivity of ~8500 S/cm for the Cu/GDC cermet and ~10200 S/cm for the modified one at 800.

  Info
Periodical
Materials Science Forum (Volumes 544-545)
Edited by
Hyungsun Kim, Junichi Hojo and Soo Wohn Lee
Pages
953-956
DOI
10.4028/www.scientific.net/MSF.544-545.953
Citation
K. R. Han, Y. J. Jeong, C. S. Kim, H. W. Lee, "Cu/GDC Cermet Anodes by Sintering via Surface Modification with MgO Sol", Materials Science Forum, Vols. 544-545, pp. 953-956, 2007
Online since
May 2007
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Price
$32.00
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