Paper Title:
Effect of Temperature on Formation of Borides in TLP Joint of a Kind of Nickel-Base Single Crystal Superalloy
  Abstract

a kind of as-cast nickel-base single crystal superalloy was TLP bonded using Ni-Cr-B amorphous foil at different temperatures. Special attention is paid to the formation of boride in diffusion zone of TLP joints at different conditions. The chemical composition and microstructure of borides were investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). At different bonding temperature, M3B2 precipitates appear distinct morphologies. At 1200°C, both blocky and plate-like borides formed owing to the diffusion of boron atoms into base metal and precipitation during the cooling process. At 1230°C or above, due to the diffusion of boron atoms the constitutional liquation of original γ/γ′ eutectics in the base metal occurs and borides formed when the system was cooled to room temperature. The analysis of TEM results reveals that M3B2 has a tetragonal structure and is rich in Mo, W, and Cr elements.

  Info
Periodical
Materials Science Forum (Volumes 546-549)
Edited by
Yafang Han et al.
Pages
1245-1248
DOI
10.4028/www.scientific.net/MSF.546-549.1245
Citation
J.D. Liu, T. Jin, N.R. Zhao, Z.H. Wang, X. F. Sun, H. R. Guan, Z. Q. Hu, "Effect of Temperature on Formation of Borides in TLP Joint of a Kind of Nickel-Base Single Crystal Superalloy", Materials Science Forum, Vols. 546-549, pp. 1245-1248, 2007
Online since
May 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Young Sup Lee, Cheol Ho Lim, C.H. Lee, K.W. Seo, Seung Y. Shin, Chang Hee Lee
Abstract:In this study, a diffusion bonding of aluminium alloy A6061 was preformed using an Ag-28Cu filler metal in order to conduct eutectic...
2772
Authors: José Lemus-Ruiz, Ana L. Salas-Villaseñor, Osvaldo Flores
Abstract:Solid-state direct diffusion bonding between commercially pure nickel and tungsten carbide (with 6%Cobalt) has been carried out in the...
127
Authors: Li Ping Shi, Ye Sheng Zhong, Jia Yu, Xiao Dong He
Abstract:Ti3SiC2 is one of the nano-layered ternary ceramics Mn+1AXn, where M is a transition metal, A is an A-group (mostly IIIA or IVA) element, and...
226
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44