Paper Title:
New Cu-Ni Substrate for Coated Conductors
  Abstract

A new approach of Cu-Ni substrate is reported, where the cubic textured Cu tape was fabricated by thermal-mechanical process, then a Ni layer was electro-deposited on the cubic textured Cu substrate. This approach is also suitable for fabricating long cubic textured metallic substrate for coated conductors. The formation of substrate texture and its thermal stability were investigated by XRD. After electro-depositing Ni layer, the sample has sharper cubic texture with ω = 5.2o and φ = 7.1o, and samples’ texture becames even better (ω = 5 o and φ = 5.2o) after annealing at 950°C for 30min.

  Info
Periodical
Materials Science Forum (Volumes 546-549)
Edited by
Yafang Han et al.
Pages
1877-1880
DOI
10.4028/www.scientific.net/MSF.546-549.1877
Citation
Z. M. Yu, L. Zhou, P. Odier, P. X. Zhang, "New Cu-Ni Substrate for Coated Conductors", Materials Science Forum, Vols. 546-549, pp. 1877-1880, 2007
Online since
May 2007
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Price
$32.00
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