3D FEM Simulation of Void Growth in Aluminum Single Crystals |
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| Journal | Materials Science Forum (Volumes 546 - 549) |
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| Volume | Progress in Light Metals, Aerospace Materials and Superconductors |
| Edited by | Yafang Han et al. |
| Pages | 893-898 |
| DOI | 10.4028/www.scientific.net/MSF.546-549.893 |
| Citation | W.H. Liu et al., 2007, Materials Science Forum, 546-549, 893 |
| Online since | May, 2007 |
| Authors | W.H. Liu, Xin Ming Zhang, Jian Guo Tang, Yu Xuan Du |
| Keywords | Aluminium, Crystallographic Orientation, Finite Element (FE) Simulation, Single Crystal, Void Growth |
| Abstract | Void growth in aluminum single crystals is simulated using the finite element method, to illustrate the effect of grain orientation on void growth, a rate dependent crystal plasticity constitutive theory is implemented as a user-defined plasticity subroutine. A three-dimension unit cell including a sphere void was employed using three-dimensional 12 active slip systems. The computed results for several grain orientations are compared, which have shown that crystallographic orientation has significant influence on growth behavior of void. And the void growth direction and shape significantly depend on the crystallographic orientation. Due to plastic flow localization and anisotropic behavior, void which has an initial sphere shape, develops an irregular shape and some corners. |
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