The microstructure and texture in dynamically recrystallized copper and two copper – tin alloys (2wt% and 4.5wt% tin) has been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 1.22 within the temperature range 200°C to 700°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization was initiated by the bulging of preexisting high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM) and twinning. The addition of tin led to an increase in the temperature at which dynamic recrystallization initiated, and furthermore to a smaller dynamically recrystallized grain size. This was attributed to the effects of solute drag causing lower HAGB mobility. Dynamic recrystallization was observed to weaken the deformation texture components of brass and Goss, as well as introduce a cube texture component which generally tended to strengthen with temperature but weaken with increasing tin additions.