On the Thermal Conductivity of Adhesively Bonded and Sintered Hollow Sphere Structures (HSS) |
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| Journal | Materials Science Forum (Volume 553) |
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| Volume | Diffusion in Solids and Liquids II |
| Edited by | Andreas Öchsner and José Grácio |
| Pages | 39-44 |
| DOI | 10.4028/www.scientific.net/MSF.553.39 |
| Citation | Thomas Fiedler et al., 2007, Materials Science Forum, 553, 39 |
| Online since | August, 2007 |
| Authors | Thomas Fiedler, Andreas Öchsner |
| Keywords | Finite Element (FE), Hollow Sphere Structures, Porous Metals, Thermal Conductivity (TC) |
| Abstract | This paper is on the geometrical effective thermal conductivity of hollow metal sphere structures. Two different technologies of joining, namely adhesive bonding and sintering, are considered. The spheres are arranged in the nodes of a cubic primitive lattice and connected by an adhesive layer, respectively directly joined by sintering. Furthermore, the influence of the cell wall thickness of the spheres on the thermal conductivity is investigated. |
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