Paper Title:
A Comparison of High Temperature Performance of SiC DMOSFETs and JFETs
  Abstract

High temperature characteristics of 4H-SiC power JFETs and DMOSFETs are presented in this paper. Both devices are based on pn junctions in 4H-SiC, and are capable of 300oC operation. The 4H-SiC JFET showed very predictable, well understood temperature dependent characteristics, because the current conduction depends on the drift of electrons in the bulk region, which is not restricted by traps in the MOS interface or at the pn junctions. On the other hand, in a 4H-SiC DMOSFET, electrons must flow through the MOS inversion layer with a very high interface state density. At high temperatures, the transconductance of the device improves and threshold voltage shifts negative because less electrons are trapped in the interface states, resulting in a much lower MOS channel resistance. This cancels out the increase in drift layer resistance, and as a result, a temperature insensitive on-resistance can be demonstrated. The performance of the two devices are compared, and a discussion of issues for their high temperature application is presented.

  Info
Periodical
Materials Science Forum (Volumes 556-557)
Edited by
N. Wright, C.M. Johnson, K. Vassilevski, I. Nikitina and A. Horsfall
Pages
775-778
DOI
10.4028/www.scientific.net/MSF.556-557.775
Citation
S. H. Ryu, S. Krishnaswami, B. A. Hull, B. Heath, F. Husna, J. Richmond, A. K. Agarwal, J. W. Palmour, J. D. Scofield, "A Comparison of High Temperature Performance of SiC DMOSFETs and JFETs", Materials Science Forum, Vols. 556-557, pp. 775-778, 2007
Online since
September 2007
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Price
$35.00
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