Paper Title:
Temperature Stability of Heteropolytypic 6H/3C FETs
  Abstract

The formation of two-dimensional electron gases (2DEG) at the polytypic 6H/3C heterojunction is investigated. The main of study was to obtain the properties of the 3C/6H structure using Technology Computer Aided Design (TCAD) software. The electron-density distribution and conduction band profile in 6H/3C SiC heterojunction are calculated as a function of temperature. Simulation of these hetero-junctions has concentrated on the I-V behaviour over a range of temperatures between 350 and 650 K. We show that the device characteristics are substantially degraded at high temperatures and this will limit the use of these devices to moderate temperature applications.

  Info
Periodical
Materials Science Forum (Volumes 556-557)
Edited by
N. Wright, C.M. Johnson, K. Vassilevski, I. Nikitina and A. Horsfall
Pages
843-846
DOI
10.4028/www.scientific.net/MSF.556-557.843
Citation
C. C. Chen, A. B. Horsfall, N. G. Wright, K. Vassilevski, "Temperature Stability of Heteropolytypic 6H/3C FETs", Materials Science Forum, Vols. 556-557, pp. 843-846, 2007
Online since
September 2007
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Price
$32.00
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