Paper Title:
Coupling between the Raman Spectroscopy and Photoemission Microscopy Techniques: Investigation of Defects in Biased 4H-SiC pin Diodes
  Abstract

Raman spectroscopy and photoemission microscopy were coupled as two complementary non-destructive optical techniques in order to study biased 4H-SiC pin diodes. These two characterization tools have been largely used for the study of semiconductors but the combination of these two techniques has hardly been reported so far. Some structural defects inducing the same electrical damage could be discriminated and identified. Temperature could be measured in operating devices and the influence of the diode operating mode on the Raman signal could be evidenced.

  Info
Periodical
Materials Science Forum (Volumes 556-557)
Edited by
N. Wright, C.M. Johnson, K. Vassilevski, I. Nikitina and A. Horsfall
Pages
909-912
DOI
10.4028/www.scientific.net/MSF.556-557.909
Citation
A. Thuaire, M. Mermoux, E. Bano, A. Crisci, F. Baillet, K. Zekentes, "Coupling between the Raman Spectroscopy and Photoemission Microscopy Techniques: Investigation of Defects in Biased 4H-SiC pin Diodes", Materials Science Forum, Vols. 556-557, pp. 909-912, 2007
Online since
September 2007
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Price
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