Paper Title:
Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature
  Abstract

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Periodical
Materials Science Forum (Volumes 558-559)
Edited by
S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
Pages
1261-1264
DOI
10.4028/www.scientific.net/MSF.558-559.1261
Citation
K. Pantleon, M. A.J. Somers, "Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature", Materials Science Forum, Vols. 558-559, pp. 1261-1264, 2007
Online since
October 2007
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Price
$32.00
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