Paper Title:
Submicrocristalline Structure in Copper after Different Severe Plastic Deformation Schemes
  Abstract

The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicrocrystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicrocrystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

  Info
Periodical
Materials Science Forum (Volumes 558-559)
Edited by
S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
Pages
189-194
DOI
10.4028/www.scientific.net/MSF.558-559.189
Citation
S. V. Dobatkin, G. A. Salishchev, A.A. Kuznetsov, T.N. Kon'kova, "Submicrocristalline Structure in Copper after Different Severe Plastic Deformation Schemes", Materials Science Forum, Vols. 558-559, pp. 189-194, 2007
Online since
October 2007
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Price
$32.00
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