Paper Title:
Dynamic Recrystallization in Copper and Copper-Tin Alloys
  Abstract

Copper, Cu-2%Sn and Cu-4.5%Sn alloys have been deformed in plane strain compression at temperatures up to 700oC and the evolution of the microstructures and textures determined by high resolution EBSD. The effect of the solute is to raise the temperature at which dynamic recrystallization occurs and to significantly reduce the size of the dynamically recrystallized grains. In all the materials, there is a small increase in the cube texture component on dynamic recrystallization. The boundary bulges which precede recrystallization are different in the copper and Cu-Sn alloys, although in both materials there is evidence that local deformation in the boundary regions plays a significant role in dynamic recrystallization.

  Info
Periodical
Materials Science Forum (Volumes 558-559)
Edited by
S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
Pages
449-456
DOI
10.4028/www.scientific.net/MSF.558-559.449
Citation
D.T. McDonald, J. F. Humphreys, P. S. Bate, I. Brough, "Dynamic Recrystallization in Copper and Copper-Tin Alloys", Materials Science Forum, Vols. 558-559, pp. 449-456, 2007
Online since
October 2007
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Price
$32.00
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