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Effect of Stacking Fault Energy on Evolution of Recrystallization and Grain Growth Textures of Metals

Journal Materials Science Forum (Volumes 558 - 559)
Volume Recrystallization and Grain Growth III
Edited by S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
Pages 93-100
DOI 10.4028/www.scientific.net/MSF.558-559.93
Citation Dong Nyung Lee, 2007, Materials Science Forum, 558-559, 93
Online since October, 2007
Authors Dong Nyung Lee
Keywords Aluminium, Aluminium Bronze, Annealing Texture, Brass, Copper (Cu), Deformation Texture, Drawing Texture, Gold, Grain Growth Texture, Recrystallisation Textures, Rolling Texture, Silver
Abstract

The drawing textures of aluminum, copper, gold, silver, and Cu-7.3% Al bronze wires are approximated by major <111>+minor <100>, except silver wire, which can have the <100> texture at extremely high reductions. The <111> component in the drawing textures of aluminum, copper, gold, and silver transform to the <100> component after recrystallization. On the other hand, the <111> deformation texture of the Cu-7.3% Al bronze wire, which has very low stackingfault- energy, remains unchanged after recrystallization. The <100> + <111> recrystallization textures change to the <111> texture after abnormal grain growth. The Brass component {110}<112> in rolling textures of high stacking-fault-energy metals such as aluminum, copper, Cu- 16% Mn, and Cu-1% P changes to the Goss orientation {110}<001> after recrystallization. However, the Brass orientation in rolling textures of low stacking-fault-energy fcc metals such as brass and silver appears to change to an orientation approximated by the {236}<385> orientation after annealing. The texture changes are discussed based on the strain-energy-release-maximization model for medium to high stacking-fault-energy metals and on grain growth for low stacking-fault energy metals.

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