Paper Title:
Stability of the Two Way Memory Effect during Thermal Cycling of a High MS Temperature Cu-Al-Ni Alloy
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 56-58)
Edited by
B.C. Muddle
Pages
541-546
DOI
10.4028/www.scientific.net/MSF.56-58.541
Citation
P. Rodriguez, G. Guénin, "Stability of the Two Way Memory Effect during Thermal Cycling of a High MS Temperature Cu-Al-Ni Alloy ", Materials Science Forum, Vols. 56-58, pp. 541-546, 1990
Online since
January 1991
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