Structural, Electrical and Magnetic Properties of Ni₃₃Fe₆₇ and Ni₂₁Fe₇₉ Films Deposited on SiO₂/Si(100) at 633 K by DC Magnetron Co-Sputtering

180nm-thick Ni33Fe67 and Ni21Fe79 films were deposited on SiO2/Si(100) substrates at 633 K by DC magnetron co-sputtering. Structural, electrical and magnetic properties of the films were investigated using X-ray diffraction, field emission scanning electron microscopy, a four-point probe technique and an alternating gradient magnetometer. The Ni21Fe79 film has a single bcc structure whereas the Ni33Fe67 film is a fcc-bcc mixed phase. The films grow with granular grains. The grain shape of the Ni21Fe79 film is triangular and rectangular. The Ni33Fe67 film consists of irregular shaped grains and a few large triangular grains. The grain size of the Ni21Fe79 film is larger than that of the Ni33Fe67 film. The resistivities of the Ni21Fe79 and Ni33Fe67 films are 1.82×10-63m and 1.09×10-63m. The saturation magnetization of the Ni21Fe79 and Ni33Fe67 films are 1.09×106 A/m and 1.02×106 A/m. The coercivity of the Ni21Fe79 and Ni33Fe67 films are 2.06×104 A/m and 8.84×103 A/m , respectively.