Paper Title:
Oxidation Behavior of Cu Nanoparticles and Formation of Hollow Cu2O Spheres
  Abstract

Oxidation behavior of Cu nanoparticles in the formation process of hollow Cu2O spheres was investigated by TEM. The thickness of Cu2O layers on Cu nanoparticles oxidized at 323 K in air was measured as a function of oxidation time. At the initial stage of oxidation until the oxide film with 2.5 nm in thickness is formed, the thickness of oxide films on Cu nanoparticles with the diameter of 10, 20 and 35 nm shows a nearly equal value regardless of diameter of Cu. After the formation of 2.5 nm layer, however, the growth rate of the oxide films on smaller nanoparticles becomes slower than that on larger nanoparticles. This result suggests that the voids formed at the Cu/Cu2O interface prevent Cu atoms from diffusing outward across the interface because the volume ratio of voids to inner Cu in smaller nanoparticles is much larger than that in larger nanoparticles.

  Info
Periodical
Materials Science Forum (Volumes 561-565)
Main Theme
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
1703-1706
DOI
10.4028/www.scientific.net/MSF.561-565.1703
Citation
R. Nakamura, D. Tokozakura, J. G. Lee, H. Mori, H. Nakajima, "Oxidation Behavior of Cu Nanoparticles and Formation of Hollow Cu2O Spheres", Materials Science Forum, Vols. 561-565, pp. 1703-1706, 2007
Online since
October 2007
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