Paper Title:
Phase Field Modeling of Recrystallization Grain Growth during Re-Aging Process in Cu-Ni-Si Alloy
  Abstract

The micro structural evolution and the mechanism of recrystallization grain growth were studied during re-aging process in Cu-Ni-Si alloy containing finely pre-aging δ-Ni2Si precipitates using computer simulations based on a diffuse-interface phase-field kinetic model. In this model, the temporal evolution of the spatially dependent field variables is determined by numerically solving the time-dependent Ginzburg-Landau (TDGL) equations for the structural variables. The simulation results quantify the effects of the precipitation on recrystallization. It is shown that the finely dispersed pre-aging δ-Ni2Si precipitates exert a strong pinning effect on the recrystallization grain boundaries. The recrystallization grain growth for r = 3 fa = 0.015 can be described as R =1.04∗t 0.33 at the beginning, followed by a gradual transition to growth stagnation. The final grain size follows a Zener type relation lim 0.49 1.41 a R r f =     for 0.01 ≤ fa ≤ 0.21 and r = 2.5 or 3.

  Info
Periodical
Materials Science Forum (Volumes 561-565)
Main Theme
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
1805-1808
DOI
10.4028/www.scientific.net/MSF.561-565.1805
Citation
Y. Q. Long, P. Liu, W. M. Zhang, "Phase Field Modeling of Recrystallization Grain Growth during Re-Aging Process in Cu-Ni-Si Alloy", Materials Science Forum, Vols. 561-565, pp. 1805-1808, 2007
Online since
October 2007
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$32.00
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