Paper Title:
Extraction of Elastic Modulus and Hardness of the Soft Metallic Films on Hard Substrates by Nanoindentation
  Abstract

A simple method to extract the intrinsic mechanical properties of the soft metallic thin films on hard substrates by nanoindenation is presented. Utilizing the geometry relationship of residual impressions obtained by the SEM image and the cross-sectional profile, the pile up error in elastic modulus determination of soft thin films by the Oliver and Pharr analysis is first corrected. Knowledge of the ‘true’ elastic modulus, the ‘true’ hardness of thin film is then extracted from the measured contact stiffness data for an elastically homogeneous film-substrate system. The present method is applied for a 504 nm Au thin film sputter deposited on the glass substrate and the results show that the ‘true’ elastic modulus and hardness of Au film are 80 GPa and 1.3 GPa, which are in agreement well with the literatures.

  Info
Periodical
Materials Science Forum (Volumes 561-565)
Main Theme
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
2005-2008
DOI
10.4028/www.scientific.net/MSF.561-565.2005
Citation
X.Y. Zhou, H. R. Wang, Z. D. Jiang, R. X. Yu, "Extraction of Elastic Modulus and Hardness of the Soft Metallic Films on Hard Substrates by Nanoindentation", Materials Science Forum, Vols. 561-565, pp. 2005-2008, 2007
Online since
October 2007
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