Paper Title:
Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint
  Abstract

The growth and morphology of the intermetallic compounds (IMC) formed at the interface between the solder ( Sn–3.5Ag–0.5Cu ) and the Cu substrate of the lead - free solder joint have been investigated by means of isothermal aging at 125°C. The scalloped Cu6Sn5 intermetallic compound layer was formed at the interface between the solder and Cu substrate upon reflow. The thickness of Cu6Sn5 layer increased with aging time. Cu3Sn appeared between Cu6Sn5 layer and Cu substrate when isothermally aged for 100 hours. Compare to Cu6Sn5 , the thickness of Cu3Sn was rather low, and nearly did not increase with aging time. In this paper, the comparison was made among the Sn-Pb and the Sn-Ag-Cu(SAC) solders which were pre-treated differently before soldering.

  Info
Periodical
Materials Science Forum (Volumes 561-565)
Main Theme
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
2115-2118
DOI
10.4028/www.scientific.net/MSF.561-565.2115
Citation
Y. Fu, Q. Zhang, F. Sun, H. Y. Bai, "Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint", Materials Science Forum, Vols. 561-565, pp. 2115-2118, 2007
Online since
October 2007
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