Paper Title:
Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds
  Abstract

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Periodical
Materials Science Forum (Volumes 561-565)
Main Theme
Edited by
Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages
539-542
DOI
10.4028/www.scientific.net/MSF.561-565.539
Citation
S. Kitaoka, N. Kawashima, K. Maeda, T. Kuno, Y. Noguchi, "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds", Materials Science Forum, Vols. 561-565, pp. 539-542, 2007
Online since
October 2007
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Price
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