Paper Title:
Influence of Delamination of Epoxy/Dielectric Interfaces on Pattern Shift and Passivation Cracking under Aeronautical Conditions
  Abstract

Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A major cause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, and Poisson’s ratios of the package materials. Here, the influence of delamination between epoxy and dielectric layers on pattern shift and passivation cracking in IC package under aeronautical conditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximum principal stresses theory using a certain 2D FEM model with different delamination length “L_c.right”. Delaminations are easy to introduce more dangerous impact to the package, because the IC microstructures endure serious thermo-mechanical loading under aeronautical working conditions. The method can be used to find the dangerous designed structure schedules and will provide a basis for selecting passivation materials of aeronautical IC packages.

  Info
Periodical
Materials Science Forum (Volumes 575-578)
Edited by
Jitai NIU, Zuyan LIU, Cheng JIN and Guangtao Zhou
Pages
919-923
DOI
10.4028/www.scientific.net/MSF.575-578.919
Citation
Y. T. He, H. P. Li, R. H. Cui, C. H. Fan, "Influence of Delamination of Epoxy/Dielectric Interfaces on Pattern Shift and Passivation Cracking under Aeronautical Conditions", Materials Science Forum, Vols. 575-578, pp. 919-923, 2008
Online since
April 2008
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$32.00
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