Paper Title:
Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer
  Abstract

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Periodical
Materials Science Forum (Volumes 575-578)
Edited by
Jitai NIU, Zuyan LIU, Cheng JIN and Guangtao Zhou
Pages
996-1001
DOI
10.4028/www.scientific.net/MSF.575-578.996
Citation
Z. Liu, C. M. Li, D. C. Niu, H. Lan, W. Z. Tang, G. C. Chen, J. H. Song, Y. M. Tong, F. X. Lu, "Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer", Materials Science Forum, Vols. 575-578, pp. 996-1001, 2008
Online since
April 2008
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