Paper Title:
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
  Abstract

In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
173-176
DOI
10.4028/www.scientific.net/MSF.580-582.173
Citation
H. S. Bang, H. J. Ji, M. Y. Li, C. Q. Wang, H. S. Bang, "Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method", Materials Science Forum, Vols. 580-582, pp. 173-176, 2008
Online since
June 2008
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$32.00
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