Paper Title:
Reproducing the Shilla Dynasty’s Direct-Bonding Granulation Process
  Abstract

Granulation is a precious metal craft process method that decorates a metal surface using tiny metal granules. It was imported into Korea during the Shilla Dynasty around 1500 years ago, and many granulation ornaments have been found with the process’s unique bonding features. The granules show a direct bonded interface with a neck. The key technology of making granules and bonding the granules is not well known. Thus, it is a technology of the Lost World. Although the exact bonding method is unidentifiable, it is known that the traditional method of preparing gold granules was time consuming and costly. Therefore, we proposed a process to reproduce the Shilla’s granulation ornament using a modern method. First, we employed atomization to produce 22K gold granules. Direct bonding was accomplished using a spot welder and vacuum jig instead of using the traditional method of graphite bed melting and direct annealing. 0.8 mm granules were successfully fabricated and bonded directly to the substrate with a necking and 35% bonding ratio, which is very similar to Shilla’s granule bonding. Moreover, to estimate the bond strength, K factors (fracture toughness index) at different bonding ratios were evaluated using a finite element method simulation. Our proposed direct bonded granule process and design were expected to have enough bond strength to be used as a key element for fine modern jewelry.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
183-190
DOI
10.4028/www.scientific.net/MSF.580-582.183
Citation
O. S. Song, J. R. Kim, M. R. Kim, "Reproducing the Shilla Dynasty’s Direct-Bonding Granulation Process", Materials Science Forum, Vols. 580-582, pp. 183-190, 2008
Online since
June 2008
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: K. Rajanna, S. Tanaka, Toshio Itoh, Masayoshi Esashi
1527
Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Yasushi Fukuzawa, Shigeru Nagasawa, Masahiro Watanabe, Shigehiko Takaoka
Abstract:To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is...
443
Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh
Abstract:For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed...
25
Authors: Jin Wei Yu
Chapter 2: Surface Engineering/Coatings
Abstract:Electroless palladium are introduced to ENEPIG surface coating technology, from reaction principle to prevent oxidation of nickel-plated, but...
777