Paper Title:
Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
  Abstract

The lead-free casting solders Sn-3.5Ag-xCo (x = 0, 0.1, 0.5 and 1.0 mass%, respectively) were subjected to isothermal aging at 150°C for 0, 1008 and 2016 h, respectively. The nanoindentation methodology was employed herein to assess the mechanical properties. In particular, the strain rate sensitivity index value was derived from the creep deformation at the dwell time of the target constant load using Mayo-Nix theory. Basically, there is no remarkable tendency of the variation of Young’s modulus after aging, while to some extent, the hardness of the alloys drops. The strain rate sensitivity index value continues to decrease with the prolonged aging time. The solder grain growth and the coarsening of the intermetallics namely, Ag3Sn and CoSn2, are responsible for the mechanical evolution of the alloys. The 1.0% (mass%) Co additive improved the hardness of the solder alloy, and caused the decrease of the strain rate sensitivity value.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
209-212
DOI
10.4028/www.scientific.net/MSF.580-582.209
Citation
F. Gao, H. Nishikawa, T. Takemoto, "Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation", Materials Science Forum, Vols. 580-582, pp. 209-212, 2008
Online since
June 2008
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$32.00
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