Paper Title:
Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
  Abstract

A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
213-216
DOI
10.4028/www.scientific.net/MSF.580-582.213
Citation
S. H. Lee, J. H. Lee, J. W. Lee, J. M. Kim, "Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs) ", Materials Science Forum, Vols. 580-582, pp. 213-216, 2008
Online since
June 2008
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