An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs) |
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| Journal | Materials Science Forum (Volumes 580 - 582) |
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| Volume | Advanced Welding and Micro Joining / Packaging for the 21st Century |
| Edited by | Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na |
| Pages | 217-220 |
| DOI | 10.4028/www.scientific.net/MSF.580-582.217 |
| Citation | Jong Min Kim et al., 2008, Materials Science Forum, 580-582, 217 |
| Online since | June, 2008 |
| Authors | Jong Min Kim, K.C. Yang, S.B. Lee, Seong Hyuk Lee, Young Eui Shin, Kyong Ho Chang, J.G. Han, Y.S. Eom, J.T. Moon, J.W. Baek, Jae Do Nam |
| Keywords | Fluxing Capacity, Low Melting Point Alloy (LMPA), Sn-Bi, Sn-In, Viscosity, Wettability |
| Abstract | A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders on two kinds of metals were investigated using an optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24ยบ. |
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