Paper Title:
Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
  Abstract

A tensile test was conducted to evaluate thermal fatigue resistances of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu lead-free solder alloys. The test is based on the strain rate change method to obtain a strain rate sensitivity index (SRSI), m. The m values were investigated at various strains during the tensile test, until fracture. The plots of m and strain where m is measured showed a linear relationship. Therefore, the m value at zero strain, m0, and the gradient of the fitting line, k, were obtained by extrapolation. Using m0 and k values, an estimation of the thermal fatigue resistance of the solder joint was attempted. It was believed that m0 and k can be taken as a guide for developing a new lead-free solder with the excellent thermal fatigue resistance. Moreover, the influences of the aging treatment on m0, k and the microstructure of the solder were also investigated.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
221-224
DOI
10.4028/www.scientific.net/MSF.580-582.221
Citation
K. Yasuda, I. Shohji, T. Takemoto, "Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index", Materials Science Forum, Vols. 580-582, pp. 221-224, 2008
Online since
June 2008
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa, Masao Kojima
Abstract:Impact properties of solder ball joints with Sn-9mass%Zn and Sn-3mass%Ag- 0.5mass%Cu lead-free solders were investigated under aging at 423...
429
Authors: Norhayanti Mohd Nasir, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman, Mohd Izrul Izwan Ramli, Rita Mohd Said
Chapter 5: Materials for Electronic and Electrical Industry
Abstract:This research has investigated the properties of low-silver Sn-1.0Ag-0.7Cu (SAC107) alloy. Different weight percentages (0, 0.25, 0.5, 0.75...
167
Authors: Nisrin Adli, Nurul Razliana Abdul Razak, Norainiza Saud
Chapter 1: Materials and Technologies for Soldering and Packaging in Electronics
Abstract:The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful...
13