Paper Title:
Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
  Abstract

The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
243-246
DOI
10.4028/www.scientific.net/MSF.580-582.243
Citation
H. Nishikawa, A. Komatsu, T. Takemoto, "Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder", Materials Science Forum, Vols. 580-582, pp. 243-246, 2008
Online since
June 2008
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Price
$32.00
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