Paper Title:
Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process
  Abstract

The effects of strain rate in rolling on microstructures and mechanical properties of a nano-grained high purity copper processed by accumulative roll bonding (ARB) were studied. The rolling during ARB was conducted with two kinds of strain rates (2.6sec-1 and 37sec-1). The microstructural evolution of the copper with ARB proceeding was somewhat different in both methods. However, the variation of mechanical properties with ARB was very similar to each other.

  Info
Periodical
Materials Science Forum (Volumes 580-582)
Edited by
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
Pages
71-74
DOI
10.4028/www.scientific.net/MSF.580-582.71
Citation
S. H. Lee, S. S. Kim, S. Z. Han, C. Y. Lim, "Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process", Materials Science Forum, Vols. 580-582, pp. 71-74, 2008
Online since
June 2008
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Price
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