Advanced Welding and Micro Joining / Packaging for the 21st Century
Materials Science Forum Volumes 580 - 582
doi:10.4028/www.scientific.net/MSF.580-582
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p117
Characterization of Weldments and Materials Using Thermoelectric Power Measurements
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320 K
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Authors: Young Do Park, A.N. Lasseigne-Jackson, J.E. Jackson, Brajendra Mishra, D.L. Olson, T. Koenig
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p121
Application of Air-Coupled Ultrasonic Techniques Using Carbon/Carbon Composites
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501 K
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Authors: In Young Yang, Yong Jun Yang, Jun Woo Park, Kil Sung Lee, Young Tae Cho, Je Woong Park, David K. Hsu, Kwang Hee Im
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p125
J-Integral Estimation for the 3-D Through-Thickness Centre-Cracks in Welds of Structural Steels
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213 K
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Authors: Chin Hyung Lee, Kyong Ho Chang
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p129
New Technology for NDT Weld Inspections – Phased Arrays and Diffraction Sizing
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231 K
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Authors: Simon Labbé, Michael Moles
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p135
Implementation Status of Performance Demonstration for Nuclear Power Plant Piping Weld Ultrasonic Examination in Korea
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283 K
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Authors: Yong Sik Kim, Hee Jong Lee, Se Kyoung Kim
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p139
Analysis on Thermal Strain of AC7A Aluminum Alloy Casting Mold for Automobile Tire by Finite Element Method
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918 K
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Authors: Je Se Choi, Yool Kwon Oh
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p143
A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
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213 K
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Authors: H.S. Sim, K.G. Kang, Seong Hyuk Lee, Jong Min Kim, Young Eui Shin
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p147
Determination of Optimum LASER Welding Parameters and the Development of a LASER Welding Technique to Enhance the Lateral Impact Strength of a Spacer Grid Assembly for a PWR Fuel Assembly
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2 M
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Authors: Kee Nam Song, Soo Sung Kim
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p151
Effect of Micro Structure in Fuel Cell Electrode on Concentration of Species in Reaction Layer
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295 K
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Authors: Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto
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p155
A Brief Review of Challenges & Technologies to Weld Dissimilar Metals in Two Industries: The Upstream Oil & Gas and the Automotive
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474 K
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Authors: Manuel Marya
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p159
High-Accuracy Optical Subassembly for High Speed Data Transmission above 10 Gb/s/ch
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394 K
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Authors: Sung Hwan Hwang, Jung Woon Lim, Hyo Hoon Park, Myung Yong Jeong, Byung Sup Rho
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p163
Thermal Resistance Control of an Optical Module Packaging by a Heat Sink of High Thermal Conductivity
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1 M
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Authors: Seung Hun Oh, Chang Seok Kim, Byung Sup Rho, Seung Boo Jung, Myung Yong Jeong
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p167
Study on Induction Spontaneous Heating Reflow
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503 K
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Authors: Hong Bo Xu, Ming Yu Li, Jong Myung Kim, Hong Bae Kim, Dae Won Kim
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p173
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
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1 M
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Authors: Hee Seon Bang, Hong Jun Ji, Ming Yu Li, Chun Qing Wang, Han Sur Bang
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p177
Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM
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707 K
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Authors: K.I. Kang, J.P. Jung, Woong Ho Bang, J.H. Park, Kyu Hwan Oh