Paper Title:
Microstructural Stability and Creep in Nanocrystals
  Abstract

Microstructural stability is an important consideration during high temperature deformation and processing of nanomaterials. We will address issues relating to triple junctions in limiting grain growth during creep as well as densification. Although early studies on deformation have considered diffusion creep as a possible rate controlling deformation mechanism in nanocrystals, a critical inspection of available data indicates that there is no strong evidence for conventional diffusion creep in such materials. The possibility of diffusion creep by rapid diffusion along triple junctions will be analyzed, and interface controlled diffusion creep will also be discussed critically. It is shown that the critical grain size for dislocation activity is similar to that for occurrence of conventional diffusion creep.

  Info
Periodical
Materials Science Forum (Volumes 584-586)
Edited by
Yuri Estrin and Hans Jürgen Maier
Pages
876-883
DOI
10.4028/www.scientific.net/MSF.584-586.876
Citation
A. H. Chokshi, "Microstructural Stability and Creep in Nanocrystals", Materials Science Forum, Vols 584-586, pp. 876-883, Jun. 2008
Online since
June 2008
Authors
Price
US$ 28,-
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