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Advanced Manufacture

Materials Science Forum Volume 594

• Papers
• Abstracts

• p-2 Committees   [ 40 K ]
• p-1 Preface   [ 16 K ]
• p1 Mechanism Design of ITO-Layer Removal from Color Filter of TFT-LCD   [ 202 K ]
  Authors: Pai Shan Pa
• p7 Design and Fabrication of a General Purpose 3D Digitizer Based on Grinding Technique   [ 448 K ]
  Authors: Wei Chen Lee, Liang Wei Chen
• p15 Prototyping of Image-Based Inspection Mechanisms by CAD and Virtual Reality Technology   [ 481 K ]
  Authors: Quang Cherng Hsu
• p22 Simulation of Dendritic Growth in Solidification of Al-Cu Alloy by Applying the Modified Cellular Automaton Model with the Growth Calculation of Nucleus within a Cell   [ 322 K ]
  Authors: Hsiun Chang Peng, Long Sun Chao
• p29 Study on Dendrite Shapes of Solidification in an Undercooled Melt   [ 267 K ]
  Authors: Ching Yen Ho, Yi Chwen Lee, Chia Sheng Shih
• p34 Simulation of Cooling Process of Medium Thickness Steel Plate   [ 144 K ]
  Authors: Ji Guang Han, Yang Bai
• p39 Deformation Characteristics on Surface Layer of White-Coated Paperboard by Center Bevel Blade Subjected to Pushing Load   [ 622 K ]
  Authors: Seksan Chaijit, Yoshikazu Yajima, Kazuya Kikuchi, Shigeru Nagasawa, Yasushi Fukuzawa, Akira Hine
• p45 A Forging Simulation by Using the Point Collocation Method with a Boundary Layer of Finite Element   [ 182 K ]
  Authors: Yong Ming Guo
• p51 Bending Die Design for a Pre-Formed Sheet Metal with a Golden Finger Feature   [ 371 K ]
  Authors: Jinn Jong Sheu, Sheng Hao Fang
• p57 An Optimization Approach to the Displacement Volumes for External Spur Gear Pumps   [ 359 K ]
  Authors: Kuo Jao Huang, Wen Ruey Chang, Wun Chuan Lian
• p72 Evaluation of UHMWPE Component under Various Positions for UKA   [ 222 K ]
  Authors: Chien Wei Liu, Wen Lung Li, Chen Tung Yu, Chia Chi Lo
• p78 Development of a Constant Temperature Environment Chamber with High Stability   [ 409 K ]
  Authors: Kuang Chao Fan, H.M. Wang, Yi Cheng Liu
• p84 Researches of a Novel 2D CMOS Thermal Based Accelerometer   [ 1010 K ]
  Authors: Chih Hsiung Shen, Shu Jung Chen, Yin Ting Yang