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Advanced Manufacture

Materials Science Forum Volume 594

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• p90 A Finite Element Investigation into the Changing Channel Angular Extrusion of Brass Alloy   [ 283 K ]
  Authors: Dyi Cheng Chen, Jia Ci Wang, Gow Yi Tzou
• p96 Fabrication and Analysis of Nano-Aluminum-Induced Low-Temperature Polycrystalline Silicon Film   [ 6 M ]
  Authors: Hsiao Yeh Chu, Ming Hang Weng, Ru Yuan Yang, Chien Wei Huang, Chien Cheng Liu
• p104 Research on Piezoelectric Actuator Driving Method of Creep Resistance   [ 311 K ]
  Authors: Wei Fan, Xiao Fen Yu, De Bao Li
• p110 The Design and Building of a Robot with Five Degrees of Freedom   [ 653 K ]
  Authors: Min Chan Hwang, Stephen F. Felszeghy
• p119 The Design and Evaluation of a Supply Chain Logistic Hub for Automobile and Parts Distribution   [ 174 K ]
  Authors: Charles V. Trappey, Amy J.C. Trappey, C.S. Liu, W.T. Lee, Y.L. Hung
• p132 Fabrication Micro-Nozzle Plates for Inkjet Print Head Using LIGA Process   [ 269 K ]
  Authors: Sheng Chih Shen, Chung Jui Lee, Min Wen Wang, Yi Cheng Chen, Yu Jen Wang, Yung Yue Chen
• p138 Effects of Substrate Geometry on Performance of Twin-Fluid Atomizer in Metal Powder Production   [ 2 M ]
  Authors: Muh Rong Wang, Che Jui Yang, Jian Duen Huang, Tien Chu Lin, Ming Shen Sheu
• p150 Synthesis of Core/Shell Type of Hybrid Magnetic Particle by Using Polyionic Copolymer with Extra Magnetic Field   [ 1 M ]
  Authors: Cheng Chien Wang, I Han Chen, Chun Rong Lin, Chuh Yung Chen
• p155 Experimental Studies of Meniscus Dynamic Behaviors in a Squeeze-Mode Piezoelectric Inkjet Printhead   [ 531 K ]
  Authors: Tzong Shyng Leu, Jan Hua Lin
• p163 Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements   [ 3 M ]
  Authors: Chao Ming Lin, Chun Yi Chu, Wei Lin Chang
• p169 Finite Element Prediction of Stack-Die Packages under Board Level Drop Test   [ 410 K ]
  Authors: Hsiang Chen Hsu, Yu Chia Hsu, Chan Lin Yeh, Yi Shao Lai
• p175 Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading   [ 273 K ]
  Authors: Hsiang Chen Hsu, Hui Yu Lee, Wen Lo Shieh
• p181 Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives   [ 954 K ]
  Authors: Jhy Cherng Tsai, Jin Fong Kao
• p187 Analysis of Conventional Spinning Process with Thermal Effects   [ 352 K ]
  Authors: Chun Ho Liu, A Cheng Wang, Kuo Zoo Liang, Sheng En Hsu
• p193 A Study of Cutting Temperatures in Turning of Glass Fiber Reinforced Plastics Materials   [ 557 K ]
  Authors: Chung Shin Chang, Lih Ren Hwang, Albert Wen Jeng Hsue