Development of a High Rate 4H-SiC Epitaxial Growth Technique Achieving Large-Area Uniformity |
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| Journal | Materials Science Forum (Volumes 600 - 603) |
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| Volume | Silicon Carbide and Related Materials 2007 |
| Edited by | Akira Suzuki, Hajime Okumura, Tsunenobu Kimoto, Takashi Fuyuki, Kenji Fukuda and Shin-ichi Nishizawa |
| Pages | 111-114 |
| DOI | 10.4028/www.scientific.net/MSF.600-603.111 |
| Citation | Masahiko Ito et al., 2008, Materials Science Forum, 600-603, 111 |
| Online since | September, 2008 |
| Authors | Masahiko Ito, L. Storasta, Hidekazu Tsuchida |
| Keywords | 4H-SiC, Epitaxial Growth, High Growth Rate, Impurities, Large Area Uniformity |
| Abstract | A vertical hot-wall type epi-reactor that makes it possible to simultaneously achieve both a high rate of epitaxial growth and large-area uniformity at the same time has been developed. A maximum growth rate of 250 µm/h is achieved at 1650 °C. Thickness uniformity of 1.1 % and doping uniformity of 6.7 % for a 65 mm radius area are achieved while maintaining a high growth rate of 79 µm/h. We also succeeded in growing a 280 µm-thick epilayer with excellent surface morphology and long carrier lifetime of ~1 µs on average. The LTPL spectrum shows free exciton peaks as dominant, and few impurity-related or intrinsic defect related peaks are observed. The DLTS measurement for an epilayer grown at 80 µm/h shows low trap concentrations of 1.2×1012 cm-3 for Z1/2 center and 6.3×1011 cm-3 for EH6/7 center, respectively. |
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