Paper Title:
Behavior of Stacking Faults in TEDREC Phenomena for 4.5 kV SiCGT
  Abstract

The behavior of stacking faults with regard to Vf degradations and TEDREC phenomena for 4.5 kV SiCGT have been investigated through the use of light emission images. Stacking faults, which cause Vf degradations, are expanded when current densities are increased. A novel phenomena of Vf degradation reduction, TEDREC phenomena, was found, which can reduce degradation by increasing operating temperature. It was observed for the first time that stacking faults become inactive by elevating temperatures to more than 150 oC in spite of existing stacking faults, which is a factor that contributes to TEDREC phenomena.

  Info
Periodical
Materials Science Forum (Volumes 600-603)
Edited by
Akira Suzuki, Hajime Okumura, Tsunenobu Kimoto, Takashi Fuyuki, Kenji Fukuda and Shin-ichi Nishizawa
Pages
1175-1178
DOI
10.4028/www.scientific.net/MSF.600-603.1175
Citation
K. Nakayama, Y. Sugawara, Y. Miyanagi, K. Asano, S. Ogata, S. Okada, T. Izumi, A. Tanaka, "Behavior of Stacking Faults in TEDREC Phenomena for 4.5 kV SiCGT", Materials Science Forum, Vols. 600-603, pp. 1175-1178, 2009
Online since
September 2008
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Price
$32.00
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